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EMS Equipment & Machinery
Infrastructure

EMS Equipment & Machinery

State-of-the-Art Production and Testing Equipment

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Equipment 1 of 4

High-Precision Screen Printer | FUJI

GPX-C designed specially for consistent highly accurate printing quality and user friendly operating environment. Machine from the base to printing section enables high accuracy printing even for large panels, and durability which can maintain printing quality. GPX-C can support 50 x 50mm to 610 x 610mm and PCB Thickness 0.4 to 6.0mm.

High-Precision Screen Printer | FUJI

Key Specifications

Positional High Accuracy: ± 0.012mm 6α
Snap off: up to 4mm, Speed: 0.1 to 40mm/Sec
Double squeeze Operational: Metal Squeeze type, 60 degree Print Angle
Alignment Accuracy: ± 0.020mm 6α
Screen Frame Size: 29" x 29"
Automatic width Adjust facility
Dry/Wet + Dry Vacuum Cleaning
Under side clearance of 25.4mm (Using back-up pins)
Equipment 2 of 4

Hi-Speed Pick & Place | FUJI

The AIMEX IIIC is designed especially for component flexibility, PCB flexibility and production flexibility. The AIMEX IIIC can support large panels up 50 x 50mm to 508 x 400mm, PCB Thickness 0.4 to 6.0mm size.

Hi-Speed Pick & Place | FUJI

Key Specifications

Rated Speed 54,000 CPH
Configured with FUJI intelligent feeder — supports component traceability, feeder maintenance function & component exhaust warning
Placement Accuracy: ± 30µm @ 3α CPK ≥ 1.00
Built-in Auto and Hybrid calibration ensures placement accuracy during production
Image Processing through CCD Camera
Configured with Fly vision camera
Offline/Online Programming supported
MS Algorithm function supports handling any ODD Shape parts using seek lines
Feeders support traceability using optional FUJItrax Software
Variable pitch, Electrically Driven feeders — Common for Paper and Emboss, 0402mm to 3225mm parts
Feeder can be loaded and unloaded during machine Production mode
Equipment 3 of 4

Reflow Oven | JT

The most efficient heat transfer reflow oven for precision soldering operations.

Reflow Oven | JT

Key Specifications

8 Top and 8 Bottom Heating Zones & 2 Cooling Zones
In-build PCB Reflow profile facility
350°C maximum operating temperature (Lead-Free Approved Reflow)
Conveyor Type: Chain + Mesh
Belt 20" Belt Conveyor (19" [483mm] usable width and 0.5" [12.5mm] pitch)
Conveyor width adjustment: Motorized
Left-to-Right transport direction
Conveyor height adjustable: Maximum 900mm ±20mm
Individual Cell Inlet and Exhausts
Flux Flow Control (flux evacuation system)
Emergency Stops (one on each corner of the system)
Over-Temperature Safety System (bi-metalic sensors)
Equipment 4 of 4

IR Based BGA Rework Station | PDR

PDR IR based BGA rework station is a high-precision and accuracy machine for µBGAs, CSPs, BGAs, QFNs, QFPs, PLCCs, SOICs Standard Rework.

IR Based BGA Rework Station | PDR

Key Specifications

Advanced Focused IR based component heating
Quartz IR PCB Preheating
Precision component Pick & Place Mechanism
Precision PCB Handling
Component Temperature control system
PCB Temperature Control system
Advanced Software based Auto Thermal profile Process Control
Camera/Prism based BGA/CSP QFN Alignment System
See It In Action

Production Video

Mefron Technologies has the State of the Art Production and Testing facility and modern infrastructure, including an exclusive line for eco-friendly Manufacturing.

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Contact our team today to learn more about our ems equipment & machinery and how they can support your project.